AS9120B, ISO 9001:2015, and FAA AC 0056B Accredited
Thank you for taking an interest in the diverse selection of electromechanical parts and Thermal Management components that we offer here on Boost Electromechanicals. You have taken a particular interest in part number 341600F00000G, which is manufactured by Boyd (Formerly Aavid) and listed with the description “Boyd 341600f00000g - 50.8mm Length, 12.7mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications.” This particular item is available for procurement at any time, and you are always welcome to fill out and submit the quote request form provided below to receive pricing options that are tailored to your unique needs and restrictions alike. With team members readily available around the clock, you can expect a response to your request for part number 341600F00000G within 15 minutes of us reviewing it.
Note : We Will Not Share Your Information With Any Third Parties.
If you happen to be facing a time constraint where you require part number 341600F00000G and other Heat Sinks items quickly, please let us know at your earliest convenience so we can discuss the expedited shipping options that we offer together. With AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation, we strive to always provide the highest caliber products through rigorous quality control measures, meaning you can steadily depend on this Boyd 341600f00000g - 50.8mm Length, 12.7mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. listing and other Boyd (Formerly Aavid) electromechanical parts we offer. Get in touch with an industry expert of ours today and see why so many customers steadily choose Boost Electromechanicals for their operational needs.
| Attachment Method | - |
| Base Product Number | 341600 |
| Category | Fans, Thermal Management, Thermal, Heat Sinks |
| Diameter | - |
| Fin Height | - |
| Material Finish | - |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Package Cooled | - |
| Power Dissipation @ Temperature Rise | - |
| Product Status | Active |
| Shape | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| Type | - |
|
|
Guaranteed on-time delivery |
|
|
Over 5100 manufacturers |
|
|
Customized and user-friendly database |
|
|
Competitive Prices |
|
|
Scheduling Flexibility |
|
|
Complete purchasing solutions |
The only independent
“We Proudly Support Intrepid Fallen Heroes Fund that serves United States Military Personal experiencing the Invisible Wounds of War : Traumatic Brain Injury (TBI) and Post Traumatic Stress (PTS). Please visit website (www.fallenheroesfund.org) and help in their valiant effort”.
We hope that you will visit us again the next time you need electromechanical parts and make us your strategic purchasing partner.
Request for Quote
